IMAPS-CPMT Poland Conference 2013

37th International Microelectronics and Packaging Conference

location: Kraków, Poland
duration: 08/22/2013 - 08/25/2013

"Every year the Polish section of International Microelectronics And Packaging Society (IMAPS) organizes technical conferences and seminars where the members meet, discuss and exchange information. It is an independent, non-profit organisation which aim is the spread of knowledge relating to hybrid microelectronics." (from the IMAPS Poland Chapter website)

In 2013 Institute of Electron Technology in cooperation with IMAPS Poland Chapter has held the conference that every year in Poland gathers leading individuals connected in any way with hybrid microelectronics. The event was followed by summer school on LTCC technology for sensor applications giving the students opportunity to encounter new ideas and application experiences and establish research relations in a field of microelectronics.

Scope
The scope of the conference covered a wide range of topics and issues, such as:

• Hybrid and Semiconductor Technology
• Design Methods and Computer Simulations
• Electronics Materials and Components
• Microcircuits Applications
• Thick-Film and Thin-Film Sensors
• Packaging and PCB
• Quality and Reliability Evaluation
• Thermal Management
• Optoelectronics and Photovoltaics
• Education in Electronics.

Papers were presented in one of the following forms: oral sessions (invited lectures) or poster sessions (contributed papers).

Agenda
For the conference agenda, see the attachment.

Publication
The Scientific Committee, formed by 30 IMAPS members from 8 countries (Austria, Germany, Ireland, Poland, Slovenia, Switzerland, United States of America, and Taiwan) reviewed and recommended the submitted papers to publish. Electronic edition of the conference proceedings was distributed during conference.
Additionally, based on authors publishing preference, the paper after additional revision had could been published after the conference in one of the journals:

• Soldering and Surface Mount Technology
• Circuit Word
• Materials Science Poland
• Microelectronics International
• Elektronika

Organizing Committee
Dr Agata Skwarek - Chairman
Mgr inż. Beata Synkiewicz
Mgr inż. Krzysztof Zaraska
Prof. Dorota Szwagierczak
Dr Jan Kulawik
Mgr Monika Machnik

For more information, please see the conference website and IMAPS Polish Chapter website.

Attachments:

Gallery: