LTCC Technology

The LTCC technology is defined as a way to produce multilayer components and devices with the help of single tapes, which are laminated together and fired in only one step. This improves performance, saves time and money due to rapid prototyping of complex structured systems, and reduces component dimensions. This technology also enables implementation of the integrated passive components (IPCs) concept and multi-chip module (MCM) concept. IPC involves manufacturing the passives as a group in or on a common substrate instead of in their own individual packages, while MCM offers integration of a number of active and passive components in a single module. As the amount of passive components (inductors, transformers, capacitors, resistors or varistors) used in IPSs and MCMs increases continuously in electronic subsystems present on today’s market, optimisation of their size and behaviour is vital for the improvement of their performance.

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